Kiss Cut Module of Oscillating Knife KCM
Because this Oscillating Knife module has a low weight and minimized stroke, the special module for semi-penetrating cutting has a very high cutting speed The module also impresses with its easy operation, quick tool changes and extreme precision Depending on the application, this vibrating knife module allows you to choose between two different processing modes: In pressure mode, the module applies a constant, user-defined pressure on the substrate with a pressure range of 30 to 1600g This enables precise, clean cuts, such as on pressure-sensitive labels, without damage to the backing material In position mode, the tool cuts through the material at a set depth
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Because this Oscillating Knife cutting module has a lighter weight and minimized stroke, the special module for semi-penetrating cutting has a very high cutting speed. This vibrating knife cutting module also impresses with its easy operation, quick tool changes and extreme precision.
Depending on the application, you can choose between two different processing modes: In pressure mode, the vibrating knife module applies a constant, user-defined pressure on the substrate, ranging from 30 to 1600g. This enables precise, clean cuts, such as on pressure-sensitive labels, without damage to the backing material. In position mode, the vibrating knife cuts the material at a set depth.
Advantages at a glance
Half-through and through-cut for all common pressure-sensitive films, labels, etc.;
The Oscillating Knife cutting module has the advantages of clean and precise cutting without damaging the substrate;
Solutions
Widely used in packaging, advertising, clothing, furniture, bags, footwear, automotive, aerospace, seal, energy, composite, etc.
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